Email: info@anligu.netTEL: +86 18118100011
Substrate-free conductive double-sided tape

Substrate-free conductive double-sided tape

Tape 89

Substrate-free conductive double-sided tape

Substrate-free conductive double-sided tape is an innovative adhesive system that combines carrier-less design with electrical conductivity, enabling direct bonding while maintaining electrical pathways. This specialized tape is revolutionizing electronics assembly, EMI shielding, and grounding applications.

Quality Assurance

We are committed to delivering consistent product quality through a well-established quality management system and comprehensive testing procedures. Quality is not just a goal — it is built into every step of our process.

Competitive Pricing

We offer high-quality products at competitive prices, aiming to deliver real value and long-term benefits to our customers.

Trust & Partnership

For decades, we have earned the trust of our clients through honesty, reliability, and a commitment to building long-term partnerships based on mutual respect.


Mobil:181-181-000-11

Email:info@anligu.net

Parameter Download

Ask on WhatsApp

Inquiry

Spread the love

Substrate-free conductive double-sided tape

The substrate-free conductive adhesive is composed of release paper coated with conductive glue.

It is featured with low resistance and equipped with low surface resistance materials, which can achieve EMI shielding, electrostatic discharge and other characteristics.

It is suitable for laminating copper foil, aluminum foil, conductive cloth, conductive foam and other materials and laminating release paper for punching processing.

NO.Material descriptionTotal thickness(mm)
N10CConductive adhesive0.01
N20CConductive adhesive0.02
N30CConductive adhesive0.03
N40CConductive adhesive0.04
N50CConductive adhesive0.05
N70CConductive adhesive0.07

Substrate-free conductive double-sided tape Primary Applications

A. Electronics Assembly

• Die-attach for IC packaging

• Flexible circuit bonding

• Display module connections (replacing ACF)

B. EMI/RFI Shielding

• Grounding gaskets in 5G devices

• Shield can attachment in smartphones

C. Energy Systems

• Battery cell interconnections

• Photovoltaic panel busbar bonding

D. Automotive Electronics

• EV battery management systems
• Sensor module grounding

上一篇: 下一篇:
展开更多
产品咨询

loading...